• UNI Semiconductor Limited
  • UNI Semiconductor Limited

After sales policy

UNI has been engaged in the research and development of components since 2002. With over 15 years of technical accumulation, UNI products ‘level of industry-level which leading in the market.

After sales outlets

UNI has established the close and strong business relationship with well-known chip and packaging manufacturers.

common problem

With diversified product line, UNI could meet ‘Customized’ needs from middle to high-end market.

Software download

With professional R & D, technical strength we are listed as long-terms partners by many cooperative customers.

While providing our customers with high-quality products and services, we always devote ourselves to provide the outstanding solutions to meet customers needs.

More services

Base on reliable quality of products, various components, our products have been widely used in various fields.

Wait for you to Contact Us

We focus our mind on providing High Reliability, High Performance and Low Cost products.

We have CMOS, BiCMOS, Bipolar integrated circuit design, package, testing...

Learn more

We provided SMD & DIP package products...

 UNI SEMICONDUCTOR   LIMITED is a professional integrated circuit design company, we focus   our mind on providing High Reliability, Hig···

cooperative partner

Uni-SEMICONDUCTOR - Outstanding solutions of you!

With cutting-edge core technologies, UNI started from semiconductor components and grow into a comprehensive company with a diversified product lineup including IC, semiconductor components and LED components. 

2002 UNI Semiconductor founded in Taiwan.

2005 Bulid semiconductor division to sell diode, triode.

2007 Bulid LED business division for LED components market

2008 Bulid MOS business division, including chip design, tape out, sealing & testing, marketing MOSFET. 

In 2013, we established LDO, DC to DC division for chip sealing & testing, marketing lower voltage power management IC.

In 2016, AC-DC Business Division was established, including chip designing, tape out, sealing and testing for power management IC market.