After sales policy
UNI has been engaged in the research and development of components since 2002. With over 15 years of technical accumulation, UNI products ‘level of industry-level which leading in the market.
After sales outlets
UNI has established the close and strong business relationship with well-known chip and packaging manufacturers.
common problem
With diversified product line, UNI could meet ‘Customized’ needs from middle to high-end market.
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With professional R & D, technical strength we are listed as long-terms partners by many cooperative customers.
While providing our customers with high-quality products and services, we always devote ourselves to provide the outstanding solutions to meet customers needs.
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Base on reliable quality of products, various components, our products have been widely used in various fields.
UNI SEMICONDUCTOR LIMITED
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We focus our mind on providing High Reliability, High Performance and Low Cost products.
We have CMOS, BiCMOS, Bipolar integrated circuit design, package, testing...
Learn moreWe provided SMD & DIP package products...
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Uni-SEMICONDUCTOR - Outstanding solutions of you!
With cutting-edge core technologies, UNI started from semiconductor components and grow into a comprehensive company with a diversified product lineup including IC, semiconductor components and LED components.
2002: UNI Semiconductor was officially established in Taiwan, initiating the exploration in the semiconductor field.
2004: Established a branch in Hong Kong, building an important window and bridge connecting the Asia-Pacific market.
2005: Established the Semiconductor Business Division, focusing on the sales and service of basic components such as diodes and transistors.
2006: Established the LED Business Division, deploying core LED components and expanding the new blueprint of the optoelectronic industry.
2013-2015: Successively deployed in the fields of MOSFET and AC-DC power management ICs, achieving breakthroughs in core technologies.
2018: Established the LDO Business Division, realizing independent R&D of the full chain including chip design, wafer fabrication, and packaging/testing.